发明名称 |
CHIP MOUNTING DEVICE AND CHIP CARRIER MOUNTING DEVICE |
摘要 |
<p>A chip carrier mounting device includes a retaining member having a predefined pattern of apertures in which are positioned preforms of joint-forming material such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. The joint-forming material may be a filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.</p> |
申请公布号 |
CA1269596(A) |
申请公布日期 |
1990.05.29 |
申请号 |
CA19870539855 |
申请日期 |
1987.06.16 |
申请人 |
RAYCHEM CORPORATION |
发明人 |
ALLEN, LESLIE J.;CHERIAN, GABE;DIAZ, STEPHEN H. |
分类号 |
B23K35/14;H01L21/58;(IPC1-7):B23K1/12 |
主分类号 |
B23K35/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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