发明名称 HERMETICALLY SEALED MODULAR ELECTRONIC COLD PLATE UTILIZING REFLUX COOLING
摘要 A modular reflux cooling plate (10) having a condensing region (11), boiling channels (12) and downcomers (16) which effect reflux cooling of electrical power modules used in aircraft and the like. The condenser (11) and boiling channels (12) can be constituted by longitudinally disposed lanced offset fins (20). Air flow fins (18) are arranged adjacent the condenser (11) to effect cooling of a coolant vapor which has entered the condenser (11) after being boiled from a liquid state in the boiling channels (12) as a result of the heat generated by one or more power modules affixed to an end plate (14) by any suitable means. Temporary thermal storage can be provided in the form of either a thickened end plate (14) or a chamber having lanced offset fins (25) and a normally solid or semi-solid material such as wax or solder.
申请公布号 IL91907(D0) 申请公布日期 1990.06.10
申请号 IL19890091907 申请日期 1989.10.05
申请人 SUNDSTRAND CORPORATION 发明人
分类号 F28D15/02;F28F3/02;H01L23/427;H05K7/20;(IPC1-7):H05K/ 主分类号 F28D15/02
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