| 摘要 |
PURPOSE:To insert smoothly and securely a semiconductor frame being placed on the guide table in the guide rails and to enable to convey the semiconductor frame in the title device by a method wherein the device is provided with frame press means, which press the front end part in the conveying direction of the frame toward the guide surface of the guide table. CONSTITUTION:A semiconductor frame 3' is conveyed-in on a guide table 9 and a feed pin hole 5 is made to move in pushingly by a position correcting cylinder 14 and is made to conform to a feed pin 6. Then a driving cylinder 12 is made to extend, and at the same time, a driving cylinder 13 is made to construct and the semiconductor frame 3' is pressed toward the guide surface of the guide table 9 by frame presses 10 and 11. The semiconductor frame 3' pressed is elastically deformed in such a way as to closely contact to the guide table 9 and is turned into the posture of fittingly face the grooves of guide rails 7a and 7b. Hereby the semiconductor frame 3' is inserted smoothly and securely in the guide rails 7a and 7b by actuation of the feed pin 6 and is conveyed. As a result, the trouble that eliminates the distortion to generate in the part of the lead frame of a semiconductor frame 3 and corrects the part of the lead frame can be omitted. |
