| 摘要 |
PURPOSE:To reduce setting irregularity between operators at the time of initializing of a die bonding position of a semiconductor element by attaching a mark on the surface of a lead frame island. CONSTITUTION:Six partial linear marks 7 for positioning bonding of a semiconductor element parallel to the sides are attached at an equal internal from the four peripheral ends of an island 1. When a semiconductor element 11 is bonded to the island 1, the element 11 is so positioned that the peripheral edges are observed with the same number of mark lines 7 from the peripheral edge of the island 1 to be accurately positioned at the center of the island 1 and die bonded. Thus, if the size of the element is extremely smaller than the size of the island of a lead frame, an irregularity in visual observation by operators can be reduced at the initializing of the die bonding position.
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