| 摘要 |
PURPOSE:To plate with high uniformity by providing a card edge at a multilayer board, and forming the plating lead of the edge of an inner layer and a through hole. CONSTITUTION:A through hole for conducting with an interior and a plating leads 1a are disposed on a card edge 1 disposed in a multilayer board. A plating lead 2b utilizing a through hole is formed at the edge 2 near the outer periphery of the board. The whole edge 2 is placed with a plating lead 3, and formed of a through hole. A 4-layer board is composed of a base material 4 of an outer layer, a base material 5 of an inner layer, and prepregs 6 for insulating patterns with the inner, outer layers, cut at the end face 8 of the board at the edge side after plating is finished, the lead 3 formed with the hole 2b is removed, and the patterns are sufficiently plated. |
