Bonding method, mounting table and substrate processing apparatus

摘要

A distance between the surface of the base member and the electrostatic chuck having the heater pattern formed on a bottom surface thereof can be uniformized. A bonding method of bonding an electrostatic chuck and a base member to each other includes forming a filling member 30 by covering irregularities of a heater pattern 9a formed on a bottom surface 61 of the electrostatic chuck 9 facing the base member 10; grinding a base member contact surface 62 of the filling member 30 facing the base member 10; and bonding the ground base member contact surface 62 of the filling member 30 to the base member 10 with an adhesive layer 31 provided therebetween.

主权项

1. A mounting table, comprising:
a base member having a peripheral protruding portion formed at a periphery of the base member such that the peripheral protruding portion is higher than a central portion of the base member; an electrostatic chuck provided on the central portion of the base member; a heater pattern formed on a bottom surface of the electrostatic chuck facing the base member; a filling member that covers irregularities of the heater pattern and has a ground base member contact surface facing the base member; an adhesive layer that bonds the base member contact surface of the filling member and the base member to each other; and a sealing member provided at an outer peripheral portion of the filling member and the adhesive layer, and is in contact with a side surface of the peripheral protruding portion of the base member.