| 摘要 |
The modifying agent (I) comprises a synthetic rubber compound (e.g. butadiene acrylonitrile rubber etc.), a silcone oil having hydroxy, carboxyl, amino or epoxy group in intra-molecule or both end groups, and an epoxy resin having at least two epoxy groups in intra-molecule or both end groups. The Epoxy resin composition (II) containing the modifying agent is prepared. The compsn. (II) has an excellent heat resistance, moisture resistance, and cracking resistance, and is useful for sealing semiconductors.
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