| 摘要 |
PURPOSE:To realize high breakdown strength without decreasing detection sensitivity of excessive heating protecting function, by mounting an output stage power part and a driving control part on individual chips, and forming a temperature detecting part of the excessive heating protecting function in an output stage power chip. CONSTITUTION:An output stage power chip 21 mounting a power semiconductor element 23 and a driving control chip 22 are soldered on respective mount heads 27. A temperature detecting part 24 of overheat protecting function is formed in the chip 21 together with the element 23. Since the detecting part 24 is formed in the chip 21, the temperature of the detecting part 24 always fluctuates substantially similarly to that of the chip 21. Hence, when the output stage power part and the driving control part are constituted by using respective chips, the detection sensitivity is not decreased, so that the high breakdown voltage and the large current operation of the output stage power part can be attained with low cost. |
