PHENOL FORMALDEHYDE ADHESIVE COMPOSITION FOR WAFERS OF WOOD HAVING A HIGH MOISTURE CONTENT

摘要

An adhesive composition is provided for bonding wafers of wood having a moisture content greater than 8%. The adhesive is in powder form suitable for wafer board and avoids the necessity of drying wood wafers to a low moisture content. The adhesive composition comprises a combination of A, a resin powder consisting of a phenol formaldehyde condensation product in acid form with thermal softening of at least about 10% when heated above 150.degree.C; B a component selected from the group consisting of cyclic carbonates, low molecular weight phenol formaldehyde resins, phenol formaldehyde resorcinol resins and mixtures thereof; C, a resin powder consisting of a phenol formaldehyde condensation product in the alkaline salt form with thermal softening of at least about 60% when heated above 150.degree.C; the composition of components A, B and C having a thermal softening of at least about 30% when heated above 150.degree.C.