| 摘要 |
A positive photoresist compsn. is composed of (A) a naphthoquinone diazide cpd. as a photoactivation component contg. formula (I) and (II), (B) a novolak resin of formula (III) as a binder resin contg. m-cresol or p-cresol, (C) at least two of ethyl cellosolve acetate, butyl acetate, xylene, cyclohexanone and methylethyl ketone as a solvent, (D) dyestuff, surfactant or plasticizer as an additive, and (E) an organic cpd. contg. at least two of benzene rings. In the formulas, D is H or (IV). The compsn. is used for the mfr. of a semiconductor device of LSI and VLSI.
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