| 摘要 |
PURPOSE:To enable the title resin sealed semiconductor device in excellent heat dissipation properties at reduced thermal resistance of a package to be manufactured by a method wherein a high heat conductive sheet is composed of a high heat conductive ceramics. CONSTITUTION:A high heat conductive sheet 9 is connected to a lead frame 12 using a bonding agent 10 so as to be spread as wide as possible while an IC chip 1 is directly connected to this high heat conductive sheet 9. This high heat conductive sheet 9 is composed of a high heat conductive ceramics 11 in ultra fine yarns spun into a fiber. Due to the high heat conductivity of the high heat conductive sheet 9, the heat can be dissipated directly from the IC chip 1 to the whole package. Through these procedures, the title resin sealed semiconductor device having excellent heat dissipation properties and reduced thermal resistance can be manufactured. |
