发明名称 MULTILAYER WIRING BOARD
摘要 PURPOSE:To do patterning flatly so as to facilitate the multilayer promotion of a pattern by connecting the first and second patterns, laminated through an insulating layer, so that they may have electric conductivity with each other through pins. CONSTITUTION:An insulating layer 4 is stacked to cover the first pattern 2 formed at the specified place of a board 1. Plural pins 5 consisting of conductive material are pressed in the specified positions of the insulating layer 4, and press-fitting is done so that the tops 5A may bite in the first pattern 2 through the insulating layer 4. Next, the upper layer 4A of the insulating layer 4 is polished, and the rear ends 5B of the pins 5 projecting from the upper layer 4A are cut, and a second pattern 3 is stacked so that the second pattern 3 may be connected to the rear ends 5b of the pins 5.
申请公布号 JPH03257893(A) 申请公布日期 1991.11.18
申请号 JP19900055547 申请日期 1990.03.07
申请人 FUJITSU LTD 发明人 SUGAWARA OMITOSHI;SATO KAZUAKI
分类号 H05K3/46;H01L21/48;H01L23/538;H05K1/03;H05K3/32;H05K3/40 主分类号 H05K3/46
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