发明名称 POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF AND POLYIMIDE MADE THEREFROM
摘要 The present disclosure relates to a polyimide precursor composition including an amic acid ester oligomer of formula (I):;;wherein r, Rx, G, P and R are as defined in the specification. The polyimide made from the polyimide precursor composition of the present disclosure provides adhesion upon hot pressing such that a quasi double-sided two-layer metal clad laminate with an appropriate peeling strength or a double-sided two-layer metal clad laminate with a high peeling strength can be provided.
申请公布号 US2016369056(A1) 申请公布日期 2016.12.22
申请号 US201615185928 申请日期 2016.06.17
申请人 ETERNAL MATERIALS CO., LTD. 发明人 WU Chung-Jen;CHIANG Shun-Jen;HUANG Po-Yu;CHOU Meng-Yen;HO Chang-Hong
分类号 C08G73/12;H05K1/03;C08K5/3472;C08G73/10;C09D179/08 主分类号 C08G73/12
代理机构 代理人
主权项 1. A polyimide precursor composition, comprising an amic acid ester oligomer of formula (I): wherein: r is an integer ranging from 1 to 200; Each Rx is independently H, C1-C14alkyl or a moiety bearing an ethylenically unsaturated group; Each R is independently C1-C14alkyl, C6-C14aryl or aralkyl, or a moiety bearing an ethylenically unsaturated group; Each G is independently a tetravalent organic group; and Each P is independently a divalent organic group, wherein based on the total moles of the divalent organic groups P in the composition, 0.1 mol % to 10 mol % of the divalent organic groups is (i) a divalent siloxane organic group having formula (A), (ii) C2-C14alkylene, or a combination thereof: wherein each R6 is independently H, C1-C4alkyl, or phenyl; k may be the same or different and is an integer greater than 0; and m is an integer greater than 0.
地址 KAOHSIUNG TW