| 摘要 |
PURPOSE:To enable application of adhesive fixing agent in a uniform thickness to a desired application shape by pressing a pressing body having a recessed part corresponding to an application shape and an application thickness to supplied fixing agent, by separating it after formation and by mounting a semiconductor chip on the formed fixing agent thereon. CONSTITUTION:A rod-shaped pressing body 18 is arranged on a pressing stage which is spaced (n) times a forward feed pitch P away from a dispensor 17. A recessed part 18b is formed on a pressing surface 18a of an edge face of the pressing body 18. The recessed part 18b is shaped to almost coincide with an application shape whereto fixing agent 14a is applied, and a thickness of the recessed part 18b is made to correspond to a scheduled application thickness. When the recessed part 18b is formed of a material of good release characteristics such as fluorocarbon resin and polyethylene, a depth thereof is made coincide with a thickness thereof. If it is formed of such materials as to make fixing agent remain in the recessed part 18b when the pressing body is separated, the depth is made larger than the thickness corresponding to a remaining amount. Accordingly, the fixing agent 14a, which is heaped up on the pressing stage before pressed, is applied as fixing agent 14b of desired shape and thickness by pressing.
|
