发明名称 EPOXY RESIN COMPOSITION
摘要 PURPOSE:To provide the subject composition having good workability, excellent in heat resistance, moisture resistance and electrical characteristics, and useful for electrical laminate boards, etc., by compounding a specific dicyclopentadiene novolak epoxy resin and a phenolic hydroxyl group-containing compound. CONSTITUTION:The objective composition contains a dicyclopentadiene novolak epoxy resin of the formula (R is H, 1-3C alkyl, halogen; (n) is 0-2; (m) is 0-4; (x) is 0-6) and at least one of phenolic hydroxyl group-containing compounds.
申请公布号 JPH04103616(A) 申请公布日期 1992.04.06
申请号 JP19900221272 申请日期 1990.08.24
申请人 DAU KEMIKARU NIHON KK 发明人 ONISHI HIDEYUKI;KISHINO YASUHIKO
分类号 C08J5/24;C08G59/06;C08G59/08;C08G59/20;C08G59/32;C08G59/38;C08G59/62;H01L23/29 主分类号 C08J5/24
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