| 摘要 |
<p>PURPOSE:To eliminate corrosion of other metals when removing a barrier film form a surface of a resistance film by forming the barrier film of a material which is soluble in alkaline solution of an ordinary temperature. CONSTITUTION:A surface of an insulating substrate 2 of an integrated circuit package 1 whereon an integrated circuit is mounted is provided with a film-like resistor 4 of a terminal resistor which matches an impedance of a signal wiring 3. The resistor 4 consists of a resistance film 10 which works as a resistor formed on a surface of the substrate 2, a barrier film 11 formed on a surface thereof and a conducting film 12 which has good conductivity formed on a surface of the film 11. The film 11 is formed of a material which is soluble in alkaline solution of an ordinary temperature. Therefore, other metals can be prevented from being corroded when the film 11 is peeled off from the film 10.</p> |
