| 摘要 |
A high acceleration object includes an electronic system which is operable at accelerations in excess of 20,000g. Connections between integrated circuit chips (130) and other portions of the electronic system are provided by metallization patterns (168) disposed on polymer dielectric layers (164) which are self-supporting across gaps (143) between components. A high density interconnect structure is disposed within the cavity of a hermetically sealed package (140). |
