| 摘要 |
PURPOSE:To fix a lead pin to a board without causing an irregularity in the film thickness of a solder on the lead pin by a method wherein an external-lead extraction terminal part and the lead pin are temporarily fixed mechanically and, after that, they are formally fixed by melting only the solder at a part where the external-lead extraction terminal pin and the lead pin are bonded. CONSTITUTION:At a lead pin 6, a lead-pin solder part 6-2 is formed in advance on the surface of a lead-pin blank 6-1 by a plating operation. Phosphor bronze, 42 alloy, Kovar or the like can be used as the blank. The lead-pin solder part is formed to be 5mum or higher so that its solderability is hard to deteriorate. First, by means of a press, the lead pin 6 is inserted mechanically into an external-lead extraction terminal part 8 formed on the surface of a board and on the side face of a through hole 10; and it is fixed temporarily. After that, a solder at the lead part of the lead pin or only a solder which has been formed after that at the upper part of the lead pin is melted only on the surface of the board 5 by means of infrared rays, a laser or the like; and the lead pin is fixed formally and connected completely. |
