LEAD FRAME OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE,申请号JP19900303479-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	LEAD FRAME OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要
申请公布号	JPH04176161(A)	申请公布日期	1992.06.23
申请号	JP19900303479	申请日期	1990.11.08
申请人	NEC KYUSHU LTD	发明人	MIURA TAKEO
分类号	H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

您可能感兴趣的专利

LIQUID CASCADING MEANS

RUNNER SUPPORT FOR SPIRAL PUMP

BUILT-IN POURER FOR A CONTAINER INCORPORATING THEREIN IMPROVED POURING CONTRIVANCE

A FASTENING MEMBER FOR ANCHORING A RAILWAY RAIL AND A RAIL-AND-FASTENING ASSEMBLY

IMPROVEMENT IN ER RELATING TO HYDRAULIC POWER TRANSMISSION SYSTEMS

IMPROVEMENT IN OR RELATING TO A HOLDER FOR A SHAVING BLADE AND A SHAVING RAZOR HAVING SAME

EGR CONTROL DEVICE

FLUID ESPECIALLY AIR SUCTION APPARATUS

METHOD OF MANUFACTURING NET STRUCTURE

SLITTER DRIVING DEVICE

SETTING DEVICE OF TARGET

INTAKE DEVICE FOR INTERNAL COMBUSTION ENGINE AND IONIZING APPARATUS FOR AIR AND FUEL IN CARBURETTOR

RICE TRANSPLANTING APPARATUS

BED SOIL LEVELING * SEEDING AND COVERING APPARATUS FOR PAPER POT

VIDEO SIGNAL PROCESSING CIRCUIT

INTERNAL COMBUSTION ENGINE

RECIPROCATING MOTION ROTARY ENGINE

QUICK COOLING DEVICE