发明名称 COMPONENT MOUNTING DEVICE
摘要 PURPOSE:To enable a component mounting device which mounts a component on a circuit board to execute the mounting of a component at high speed by a method wherein a problem that it takes a time to mount a component due to that the electronic component is recognized by a camera fixed at a certain position is solved. CONSTITUTION:A two-dimensionally movable robot 7 mounted with a camera 9 which picks up the image of a mirror 8 provided adjacent to a suction nozzle 3 and a computer 5 which corrects a component 2 in mounting position basing on the inputted image are provided, whereby the component 2 can be mounted at a high speed as it is measured in attitude and corrected in position while the component 2 is sucked and transferred to a mounting position on a circuit board 6.
申请公布号 JPH04263498(A) 申请公布日期 1992.09.18
申请号 JP19910024435 申请日期 1991.02.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMAMOTO MINORU;OJI SHIRO;OKUDA OSAMU
分类号 B23P21/00;H05K13/04;H05K13/08 主分类号 B23P21/00
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