发明名称 |
COMPONENT MOUNTING DEVICE |
摘要 |
PURPOSE:To enable a component mounting device which mounts a component on a circuit board to execute the mounting of a component at high speed by a method wherein a problem that it takes a time to mount a component due to that the electronic component is recognized by a camera fixed at a certain position is solved. CONSTITUTION:A two-dimensionally movable robot 7 mounted with a camera 9 which picks up the image of a mirror 8 provided adjacent to a suction nozzle 3 and a computer 5 which corrects a component 2 in mounting position basing on the inputted image are provided, whereby the component 2 can be mounted at a high speed as it is measured in attitude and corrected in position while the component 2 is sucked and transferred to a mounting position on a circuit board 6. |
申请公布号 |
JPH04263498(A) |
申请公布日期 |
1992.09.18 |
申请号 |
JP19910024435 |
申请日期 |
1991.02.19 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
YAMAMOTO MINORU;OJI SHIRO;OKUDA OSAMU |
分类号 |
B23P21/00;H05K13/04;H05K13/08 |
主分类号 |
B23P21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|