摘要 |
<p>PURPOSE:To provide the dry-chuck rubber capable of smoothly inserting a metallic spatula for removing the vacuum chuck loaded with a wafer as it is in relation to the title wafer holding dry-chuck rubber to be interposed between the wafer and the vacuum chuck suction-holding the wafer to be processed. CONSTITUTION:The title wafer holding dry-chuck rubber comprising a sheet rubber 3a is provided with the separation means (the trenches 4 in this embodiment as shown in Fig.1) scattered on the surface 3c in the vacuum chuck side so that the sheet rubber 3a may not be partially brought into contact with the suction surface of the vacuum chuck. Within the other embodiments, said separation means may be either the roughened surface of a metallic film and the rubber 3a or the protrusions formed into one bodies in the rubber 3a.</p> |