| 摘要 |
A circuit board comprises a sheet (10) which is characterised by a surface (12) carrying electrical circuitry (14) and a layer (18) behind the surface (12) and in heat-conducting communication with it. The layer (18) comprises a mass of diamond or cubic boron nitride particles in a polymeric, metallic or ceramic matrix. The concentration of diamond or cubic boron nitride in the matrix is typically 30 to 60 percent by weight. <IMAGE> |
