发明名称 ELECTRONIC COMPONENT MOUNTING EQUIPMENT
摘要 PURPOSE:To mount electronic components while satisfying required mounting precision, by measuring and correcting positional deviation for chips classified according to their types. CONSTITUTION:A transferring head 3 has a plurality of nozzles 54, 55 for sucking electronic components. The one side nozzle 54 has a chuck pawl 71 which abuts, from four directions, against the side wall surface of a rectangular electronic component P1 sucked by the nozzle 54 and regulates the position of the electronic component P1. On the other nozzle 55 side, light diffusion plates 41, 42 which scatter the illumination light projected from a light source 23 installed in a recognition part 21 are installed, and electronic components P2, P3 sucked by the nozzle 55 are measured with a camera 24 and a laser equipment 31.
申请公布号 JPH04334100(A) 申请公布日期 1992.11.20
申请号 JP19910105419 申请日期 1991.05.10
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TSUZUKI SHINGO;SAKAI EIJI;NAKAHARA DAIZO
分类号 B23P21/00;H04N5/225;H04N7/18;H05K13/04 主分类号 B23P21/00
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