发明名称 STUB MINIMIZATION USING DOUBLE SET OF SIGNAL TERMINAL IN ASSEMBLY WITH NO WIRE BOND FOR PACKAGE BOARD
摘要 SOLUTION: An ultracompact electronic package 100 includes an ultracompact electronic element 101 having a memory array, a terminal 104 on the surface 110 of a board 102 is configured to be connected with an external component, and a board contact 121 exposed in the surface 108 of the board 102 on the opposite side faces the element contact 111 of the ultracompact electronic element 101 and is bonded thereto.EFFECT: A terminal includes first terminals 104 arranged at positions in a first set 114 and a second set 124 of terminals arranged, respectively, on the opposite sides of a theoretical axis. Each set of the first terminal 104 carries address information that can be used by a circuit in the ultracompact electronic package 100 for determining an addressable memory location. Signal assignment of the first terminal 104 in the first set 114 may be a mirror image of signal assignment of the first terminal in the second set 124.SELECTED DRAWING: Figure 6
申请公布号 JP2016195269(A) 申请公布日期 2016.11.17
申请号 JP20160132320 申请日期 2016.07.04
申请人 INVENSYS CORP 发明人 RICHARD DEWITT CRISP;WAEL ZOHNI;BELGACEM HABA;FRANK LAMBRECHT
分类号 H01L25/04;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L25/04
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