发明名称 発光装置の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting device which forms irregularities having desired shapes on a surface of a sealing material and effectively improves the light extraction efficiency.SOLUTION: The manufacturing method of a light emitting device 1 according to one embodiment of the invention includes the steps of: sealing an LED chip 2 by a sealing material 5; and pressing a sheet 10 having multiple through holes 11 to the surface of the sealing material 5 while releasing air in the through holes 11 to the upper side and forming protrusions 6 which correspond to the through holes 11 on the surface of the sealing material 5.
申请公布号 JP6024525(B2) 申请公布日期 2016.11.16
申请号 JP20130045750 申请日期 2013.03.07
申请人 豊田合成株式会社 发明人 土屋 陽祐;田嶌 博幸;下西 正太;仙石 昌
分类号 H01L33/54 主分类号 H01L33/54
代理机构 代理人
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