发明名称 ANTI-STICK ELECTROSTATIC CHUCK FOR A LOW PRESSURE ENVIRONMENT
摘要 An electrostatic chuck (4) for holding a workpiece (2) in a low pressure environment. The chuck (4) comprises a dielectric substrate (8) fabricated of a material that does not contain polar molecules that are free to move in response to the application of an electric field (V). This avoids the problem of the workpiece (2) sticking to the chuck (4) after the energizing voltage (V) has been removed. In an environment in which high temperatures are employed, the dielectric (8) is coupled to a metallic heat conductor (23) via a plurality of metallic pins (22) that couple heat and are free to flex in response to motion caused by differentials in thermal expansion coefficients between the metal (23) and the dielectric (8). The chuck (4) is preferably fabricated from two substantially planar dielectric members (30,33) sandwiched around a brazing compound (11,13) which become electrically conductive electrodes (11,13) after the assembly is heated and then cooled. <IMAGE>
申请公布号 EP0541400(A3) 申请公布日期 1993.06.30
申请号 EP19920310212 申请日期 1992.11.09
申请人 VARIAN ASSOCIATES, INC. 发明人 SHERMAN, ARTHUR
分类号 B23Q3/15;H01L21/683;H02N13/00;(IPC1-7):H01L21/00 主分类号 B23Q3/15
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