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发明名称
WAFER HEAT TREATMENT DEVICE
摘要
申请公布号
JPH05166819(A)
申请公布日期
1993.07.02
申请号
JP19910336485
申请日期
1991.12.19
申请人
MITSUBISHI ELECTRIC CORP
发明人
TORII YUTAKA
分类号
F27B17/00;H01L21/324
主分类号
F27B17/00
代理机构
代理人
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