| 摘要 |
The application of electrochemical reduction treatment liquids and electroless reduction treatment liquids to elements such as circuit boards for cleaning metallic surfaces in preparation for soldering is accomplished using a wave of the treatment liquid over a liquid tank. A wave treatment has advantages over spraying, which causes too much atomizing, and dipping, which is slow and requires complicated conveyors that are multi-directional. The method comprises forming a wave of reduction treatment liquid in an atmosphere having a limited included oxygen content and passing components through the wave so the reduction treatment liquid contacts the surfaces to be solder coated. |
