High density organic bridge device and method

摘要

Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.

主权项

1. A microelectronic package comprising:
an organic polymer substrate created using a first set of design rules having a first wire width of about 40 μm and first wire spacing of about 40 μm; an organic polymer bridge embedded in the substrate, created using a second set of design rules in at least portion of the organic polymer bridge, the second set of design rules having a second wire width of about 3 μm and a second wire spacing of about 3 μm; a first interconnect structure at a first location of the organic polymer bridge and a second interconnect structure at a second location of the organic polymer bridge; and an electrically conductive path in the organic polymer bridge connecting the first interconnect structure to the second interconnect structure.