| 摘要 |
The present invention provides a metal printed circuit board (PCB), which can improve the heat radiating performance of an electronic component, such as a light emitting diode (LED) chip, and a method for manufacturing the same. In addition, the present invention provides an LED package structure, which has an LED chip packaged on a metal PCB, and a method for manufacturing the same. The metal PCB according to the present invention comprises: a metal base, which has first and second electrodes formed at an interval from each other; an insulating layer, which fills the gap between the first and second electrodes; first and second upper conductor patterns, which are formed on the upper surfaces of the first and second electrodes, respectively; and first and second lower conductor patterns, which are formed on the lower surfaces of the first and second electrodes, respectively. An LED package structure according to another aspect of the present invention comprises an LED chip, which is packaged in first and second upper conductor patterns of a metal PCB. An LED package structure according to the present invention comprises an LED chip, which is packaged in first and second upper conductor patterns of a metal PCB. The present invention is advantageous in that the heat radiating performance of the LED chip can be improved, and the simple configuration and easy manufacturing can reduce the production cost. |
