| 摘要 |
PROBLEM TO BE SOLVED: To form a lead plating film efficiently on the surface of an insulation substrate, e.g. a fabric, with a sufficient thickness.SOLUTION: A method of forming a lead plating film on the surface of an insulation substrate includes a step of roughening the surface of the insulation substrate, a step of making a catalyst adsorbed on the roughened surface of the insulation substrate, a step of forming a metal film on the surface of the insulation substrate by metalizing the catalyst and a step of forming a lead plating film on the metal film. The method uses a polyester fabric as the insulation substrate and comprises removing stains on the surface of the polyester fabric by a defatting treatment using a defatting agent, immersing in a potassium hydroxide solution to roughen the surface, making palladium chloride catalyst adsorbed, metalizing palladium chloride to form a copper film by electroless copper plating and forming a lead plating film on the copper film by electrolytic plating. |
