| 摘要 |
PROBLEM TO BE SOLVED: To provide a white thermosetting epoxy-silicone hybrid resin composition for an optical semiconductor device, which gives a cured product maintaining whiteness, heat resistance and light fastness and having excellent strength.SOLUTION: The white thermosetting epoxy-silicone hybrid resin composition comprises (A) a thermosetting silicone resin, (B) a triazine derivative epoxy resin having at least one epoxy group in one molecule, (C) an acid anhydride curing agent, (D) a white pigment, (E) an inorganic filler, and if necessary, (F) a curing accelerator and (G) an antioxidant. When a prepolymer is prepared by preliminarily fusing and mixing components (B) and (C), component (A) is also simultaneously fused and mixed. The present invention also discloses a production method of the resin composition, a premolded package in which an LED is sealed with a cured product of the above composition, and an LED device having the premolded package. |
