发明名称 Heat sink mounting apparatus
摘要 A clip having parallel edge frames with pockets at each end and connected by transverse beams is used to removeably secure a heat sink to an orthogonal device package by inserting the corners of the device package in the pockets to secure the heat sink between the transverse beams and the surface of the device package.
申请公布号 US5276585(A) 申请公布日期 1994.01.04
申请号 US19920977220 申请日期 1992.11.16
申请人 THERMALLOY, INC. 发明人 SMITHERS, MATTHEW C.
分类号 H01L23/367;H01L23/40;(IPC1-7):H05K7/20 主分类号 H01L23/367
代理机构 代理人
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