| 摘要 |
PURPOSE:To surely cut without giving thermal shock to the whole body to be machined by preliminarily heating a target position locally of the body to be machined with a laser beam of low level, and then executing cutting of the objective part with a laser beam of high level. CONSTITUTION:A laser beam 12 of a low level being not reached to cutting from a laser beam oscillator 13 irradiates the part preliminarily made to a target by focusing, and the temperature of the part being made as the target is increased and preliminarily heated. Due to this pre-heating, the temperature of the target part is increased, then the laser beam 12 of a high level is emitted from a laser beam source and the objective part is cut. Therefore, the target part can be only locally heated with the pre-heating, and a fusing possible part 10A can be made to the change of phase in a liquid like. So, the fusing possible part 10A can be surely cut, even if it is existed in a deep part of the IC. Further, the pre-heating is executed with the laser beam 12, only the target part is locally heated and the thermal shock is not given to whole of the body to be machined 10. |
