| 摘要 |
PURPOSE:To bond bumps firmly on aluminum electrode of an LSI chip by a punching jig, which has a punch and a dice and forces punched metal pieces against heated electrode while it is rotated. CONSTITUTION:As for bump forming process, metal material is punched out through a dice 10 by shifting a punch 1 downward by an actuator 4 and an actuator arm 5. The metal piece punched out by shifting the punch 1 downward is pressed to the Al electrode of an LSI chip, a vibrating element 3 is vibrated simultaneously with the pressing and the rotating vibration is applied to the punch 1 and the metal piece. Friction is generated between the metal piece and the Al electrode by the rotating vibration and the metal piece with the torn Al oxide film on the Al electrode is connected with the Al electrode. Thus, the bump allowing stable junction with the LSI chip Al electrode is formed. |
