ONE-PACK TYPE NORMAL TEMPERATURE MOISTURE-CURABLE ADHESIVE COMPOSITION FOR WOODY FLOOR MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a one-pack type normal temperature moisture-curable adhesive composition which can reduce a joint gap of a floor material when used as an adhesive for a woody floor material.SOLUTION: There is provided a one-pack type normal temperature moisture-curable adhesive composition which comprises (A) an oxyalkylene-based polymer having a silicon-containing group which has a hydroxyl group or a hydrolyzable group bonded to a silicon atom and is capable of crosslinking by forming a siloxane bond, (B) a compound having a silicon-containing group which has a hydroxyl group or a hydrolyzable group bonded to a silicon atom and is capable of crosslinking by forming a siloxane bond and an amino group or an imine derivative of the compound, (C) a tetravalent tin compound and (D) a (meth)acrylic compound having a crosslinkable silicon group.SELECTED DRAWING: Figure 1