STEM FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a stem for a semiconductor device capable of reducing the manufacturing cost.SOLUTION: The stem 10 for a semiconductor device has an eyelet 20 formed by integrally forming a main body portion 21 and a heat radiation portion 22 erected on an upper surface 21A of the main body portion 21. The stem 10 comprises a through hole 21X including an opening portion A1 and an opening portion A2 formed to communicate with the opening portion A1 on an upper surface 21A side of the main body portion 21 and formed to have a smaller diameter than the opening portion A1, and a signal lead 30 inserted through the through hole 21X and sealed with a sealing material 35 filling the opening portion A1. The stem 10 has a wiring board 40 joined to a mounting surface 22 A of the heat radiation portion 22 and having a conductor pattern 42 connected to the signal lead 30 and a mounting portion on which the semiconductor element is mounted. The heat radiation portion 22 is formed at a position overlapping with a part of the opening portion A1 in a plan view and is provided at a position not overlapping the opening portion A2 in plan view. In the opening portion A2, an air layer 36 is formed.SELECTED DRAWING: Figure 2