RFID integrated circuits with large contact pads

摘要

Technologies are generally directed to assembly of a Radio Frequency Identification (RFID) tag precursor. An assembly may be provided, the assembly having an RFID integrated circuit (IC), a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface, in which a first portion of the redistribution layer is electrically connected to the IC through a first electrical connection. A substrate having a first antenna terminal to the assembly may be attached with an adhesive, and at least a first portion of a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer may be reacted with a reactant to make the first portion of the nonconductive barrier conductive. A second electrical connection may then be formed between the first antenna terminal and the first portion of the redistribution layer through the first portion of the nonconductive barrier.

主权项

1. A method to assemble a Radio Frequency Identification (RFID) tag precursor, the method comprising:
providing an assembly having an RFID integrated circuit (IC), a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface, in which a first portion of the redistribution layer is electrically connected to the IC through a first electrical connection; attaching, with an adhesive, a substrate having a first antenna terminal to the assembly; reacting, with a reactant, at least a first portion of a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer to make the first portion of the nonconductive barrier conductive; and forming a second electrical connection between the first antenna terminal and the first portion of the redistribution layer through the first portion of the nonconductive barrier.