Composition and methods of forming solder bump and flip chip using the same

摘要

Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

主权项

1. A method of forming a flip chip, comprising:
providing a first substrate on which first conductive patterns are formed and a second substrate on which second conductive patterns are formed; arranging the first substrate and the second substrate such that the first conductive patterns and the second conductive patterns face each other; providing a first composition between the first and second substrates such that the first composition comes in contact with an entire upper surface of the second substrate and fills a space between the first and second substrates, the first composition comprising a low melting point solder, a thermal-curable polymer resin, and a curing agent of an anhydride family material; and forming a contact portion connecting the first and second conductive patterns, the contact portion being made of the low melting point solder.