发明名称 Method for mounting a component in or on a circuit board, and circuit board
摘要 In a method for mounting an element or component having at least one metal surface in or on a circuit board containing at least one conducting layer made of metal material, a connection between the at least one metal surface of the element and the at least one conducting layer of the circuit board is formed using ultrasonic welding or high-frequency friction welding in order to create a mechanically stable and resistant connection or attachment having good conductivity. Furthermore, a circuit board is disclosed in which at least one element or component having a metal surface is or can be connected to a conducting or conductive layer of the circuit board using ultrasonic welding or high-frequency friction welding.
申请公布号 US9462701(B2) 申请公布日期 2016.10.04
申请号 US201113988385 申请日期 2011.11.16
申请人 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT 发明人 Weichslberger Guenther;Drofenik Dietmar
分类号 H05K1/09;H05K3/32;H05K1/14;H05K3/40;H05K1/18 主分类号 H05K1/09
代理机构 Jacobson Holman, PLLC. 代理人 Jacobson Holman, PLLC.
主权项 1. A method for mounting an element having at least one metal surface in or on a circuit board containing at least one conducting layer made of conducting material, wherein a connection between the at least one metal surface of the element and the at least one conducting layer of the circuit board is formed using ultrasonic welding or high-frequency friction welding, wherein the element mounted in or on the circuit board is formed by a bi- or tri-metal substrate, wherein a layer of the element facing the at least one conducting layer of the circuit board is formed by copper or a Cu-containing alloy, wherein a substantially full-surface connection is formed between the at least one metal surface of the element and the at least one conducting layer of the circuit board, wherein a further layer of the element facing away from the layer facing the at least one conducting layer of the circuit board is formed by a metal different from copper, wherein the method further comprises a step of connecting an energy supply to the further layer of the element facing away from the layer facing the at least one conducting layer of conducting material of the circuit board, wherein the further layer of the element is made of aluminum or an aluminum alloy.
地址 Leoben-Hinterberg AT