| 摘要 |
PROBLEM TO BE SOLVED: To achieve a manufacturing method for a semiconductor device which can secure stable joining quality.SOLUTION: The manufacturing method for a semiconductor device performs: a pre-joining step of placing an insulation layer 2 having a metal plate 1 provided on an upper surface on a pedestal 3, placing a metal terminal 4 on the metal plate 1, pressing an ultrasonic tool 5 against the metal terminal 4 to apply pressurizing force Pp to the terminal, and thereby fixing the metal terminal 4 and the metal plate 1 in a parallel state; and a main joining step of pressing the ultrasonic tool 5 against the metal terminal 4, applying ultrasonic vibration Vm to the terminal while applying pressurizing force Pm thereto, and thereby ultra-joining the metal terminal 4 to the metal plate 1 after the pre-joining step.SELECTED DRAWING: Figure 4 |
