| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel compound capable of omitting high temperature burning required for imidization for forming a polyimide film so far and forming the polyimide film excellent in heat resistance, insulation property and adhesion at lower temperature for shorter time.SOLUTION: There is provide an oxetane imide compound (A) represented by the formula (1). (1), where X is a tetravalent organic group having 2 to 100 carbon atoms, a plurality of Y are each independently a bivalent organic group having 1 to 100 carbon atoms, a plurality of Zare each independently an alkylene group having 1 to 10 carbon atoms and a plurality of Zare each independently hydrogen, methyl or ethyl.SELECTED DRAWING: None |
