POLISHING METHOD AND POLISHING APPARATUS UTILIZING MICRONANOBUBBLE

摘要

PROBLEM TO BE SOLVED: To provide a polishing method and a polishing apparatus utilizing micronanobubbles which enable polishing efficiency to be increased and the lifetime of a polishing member to be improved while maintaining a high-precision surface flatness by effectively exhibiting an autonomous dress control function likewise as a conventional ELID method in a polishing method performed by using an elastic bond grindstone such as rubber.SOLUTION: A polishing method for polishing the surface of a solid substrate by disposing the face to be polished of the solid substrate by facing an elastic bond grindstone enables polishing to be performed by having micronanobubbles of at least any gas of air, oxygen, or ozone in the polishing face, and by polishing continuously or intermittently flowing a polishing liquid with an average grain diameter of micronanobubble of 100 mm or preferably 30 nm or less when measured by an ice-packed embedding method. A polishing apparatus of this invention comprises a micronanobubble generator has such an average grain diameter.SELECTED DRAWING: Figure 1