| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a light emitting device including a flexible substrate, in which separation is performed without separation at an interface between a light emitting layer and an electrode, although, in the case where the adhesion between a light emitting layer and an electrode is low, separation may occur at an interface between the light emitting layer and the electrode when a separation layer is separated from a layer to be separated by physical force.SOLUTION: In a method for manufacturing a light emitting device, a spacer made of a light absorbing material which absorbs laser beams is formed over a partition of one of substrates, a coloring layer is formed over the other substrate, and each of them is bonded on the substrates with the use of an adhesive layer. A light emitting layer and an electrode which are formed over the spacer are irradiated with a laser beam through the coloring layer, so that at least the adhesive layer among the light emitting layer, the electrode, the coloring layer, and the adhesive layer is melted to form a fixed portion where the adhesive layer and the spacer are bonded by welding.SELECTED DRAWING: Figure 5 |
