发明名称 RESIN COMPOSITE MATERIAL CURING DEVICE, CURING METHOD, AND RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To save the labor caused by the molding of a resin composite material, further, to attain the simplification of curing equipment and energy saving, and to reduce the production cost of a resin molding.SOLUTION: Provided is a resin composite material curing device 1 comprising: an environment set part (electromagnetic wave irradiation part 5) imparting the specified physical environment (electromagnetic wave EW) to an uncured resin composite material 2 including a metal nano material 2a self-heat generated when being placed on a specified physical environment of increasing the molecular motion amount of an object (e.g., the irradiation of an electromagnetic wave EW), ; a pressure body 6 provided on the surface of the resin composite material 2 so as to be pressure-welded; and a pressure-welding driving part 7 pressure-welding the pressure body 6 on the surface of the resin composite material 2 in a state where the specified physical environment (e.g., the irradiation of the electromagnetic wave EW) is applied to the resin composite material 2 by the environment set part (electromagnet wave irradiation part 5).SELECTED DRAWING: Figure 1
申请公布号 JP2016221930(A) 申请公布日期 2016.12.28
申请号 JP20150113321 申请日期 2015.06.03
申请人 MITSUBISHI HEAVY IND LTD 发明人 KAMIHARA NOBUYUKI;ABE TOSHIO
分类号 B29C35/08;B29C43/18;B29C43/32;B29C43/52 主分类号 B29C35/08
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