| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of obtaining a wafer level chip size package with good quality.SOLUTION: A cutting groove 210 having a depth corresponding to the finished thickness of a device is formed along a planned dividing line from the front side of a wafer 2 by a cutting blade having a first thickness, a mold resin 40 is laid on the surface of the wafer and buried in a cut groove, a protective member is attached to the surface of a mold resin, the backside of the wafer is ground to expose the cut grooves, a half-cut groove 401 is formed by cutting the mold resin buried in the cut groove from the back surface side of the wafer at a depth of approximately half by a cutting blade 323 having a second thickness thinner than the first thickness, after attaching the support member to the back side of the wafer, the protective member affixed to the surface is peeled off, and an area of a mold resin buried in a cutting groove is cut from the front side of the wafer by a cutting blade having the second thickness, and the mold resin is completely cut and divided into individual devices.SELECTED DRAWING: Figure 11 |
