MANUFACTURING METHOD OF LAMINATE AND MANUFACTURING METHOD OF WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminate excellent in fine wire forming property while reducing thickness of a resin layer and excellent adhesiveness of the resin layer and a conductor layer.SOLUTION: There is provided a manufacturing method of a laminate including a process of a resin composition layer on a substrate to obtain a laminate, where the substrate contains a glass substrate or a silicon wafer, thickness of the resin composition layer is 10 μm or less and the resin composition layer contains an epoxy resin having a structural unit derived from alkylene glycol having 3 or more carbon atoms and an ester group-containing compound.SELECTED DRAWING: None