发明名称 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To realize the suppression of alloy scattering, the reduction of a crystal defect at the boundary surface of a space layer with a carrier running layer, and high carrier mobility by the improvement of the surface flatness of the spacer layer, while maintaining high carrier concentration.SOLUTION: A compound semiconductor device includes: a carrier running layer 2b; a carrier supply layer 2d, composed of InAlN, formed upward of the carrier running layer 2b; and a spacer layer 2c, composed of at least one of AlGaN and InAlGaN, formed between the carrier running layer 2b and the carrier supply layer 2d.SELECTED DRAWING: Figure 2
申请公布号 JP2016225578(A) 申请公布日期 2016.12.28
申请号 JP20150113509 申请日期 2015.06.03
申请人 FUJITSU LTD 发明人 KOTANI JUNJI;NAKAMURA TETSUKAZU;ISHIGURO TETSURO
分类号 H01L21/338;H01L21/336;H01L29/417;H01L29/778;H01L29/78;H01L29/812;H02M3/28 主分类号 H01L21/338
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