| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer evaluation method capable of classifying all LPDs into a killer defect and a foreign substance while including even a saturated LPD from which quantitative size information cannot be obtained.SOLUTION: The semiconductor wafer evaluation method includes the steps of: detecting the LPD of a semiconductor wafer that is a sample for inspection, in two measurement modes of DWO and DNO; classifying a size of the LPD; calculating a distance and a relative angle between detection coordinates in the two measurement modes; presetting a discrimination criterion that discriminates the LPD as a foreign substance or a killer defect for each classification size; detecting the LPD of a semiconductor wafer that is an evaluation object in the two measurement modes; classifying the size of the LPD of the evaluation object; calculating the distance and the relative angle between the detection coordinates regarding the evaluation object; and classifying the LPD that is detected on a surface of the evaluation object into the killer defect or the foreign substance based on results of the calculation and the discrimination criterion.SELECTED DRAWING: Figure 1 |
