| 摘要 |
An electronic device (14) includes a sealing plate (33) including a first surface (41) connected to a pressure chamber formation substrate (29), and a second surface (42) being on an opposite side of the first surface and having a drive IC (34) provided thereon, the sealing plate (33) includes a first region in which a plurality of individual connection terminals (54) are arranged in a first direction, and a second region being in a position different from the first region, on the second surface, a plurality of bump electrodes (40) are arranged at a pitch (P2) different from a pitch (P1) of an individual connection terminal (54), in a region overlapping a second region, on the first surface of the sealing plate (33), and a wiring group (45, 46, 47) connecting the individual connection terminal (54) and a bump electrode (40) includes a first wiring (61) of which a position of a pass-through wiring (45) relaying the first surface (41) and the second surface (42) is within the first region, and a second wiring (62) of which a position of a pass-through wiring (45) connecting the first surface (41) and the second surface (42) is within the second region. |
